The unique design of the POWATEC L-200 Manual Laminator allows for the lamination of sticky foil or UV-foil onto wafers in a single pass. A special chuck holds the wafer in place with vacuum during laminating.

The lamination process is simple:

Place the wafer onto the lamination chuck. The wafer should lay completely flat on the chuck centre positioned through the three pins. Pull the tape evenly from the roll and stick it to the back edge on the front plate. Roll the rubber pad roller over the wafer with a light but even pressure. Bring the foil-cutting mechanism down and apply light pressure to the crank and rotate it to cut the foil at the edge of the wafer. To cut the tape from the roll, apply a downward pressure to the ball grip on the knife holder, and slide the knife once to the left or right side. Swing the foil-cutting mechanism up and remove the waste foil. Remove the mounted wafer from the lamination chuck.

Key features:

• Up to 8" wafer size
• Chuck design with flat or without flat
• Adjustable tape tension
• Easy to use
• Low operating cost
• UPH, taped wafers/h 80-90 pcs

Options:

• Conversion kit for 8" wafers
• Protection tape winder (PTW)
• Anti static bar
• Support table