Skip to main content Skip to page footer

POWATEC specializes in the engineering and production of manual and semi-automatic equipment related to the singulation of wafers and substrates in the semiconductor industry. Our products include Wafer Mounters, Wafer Laminators, UV Tape Release Equipment, UV Curing Systems, Wafer Expanders, Film Frames, Cassettes/Magazines, and Accessories. 

28

Years of Experience

5000

Machines Delivered

750

Customers

50

Countries

Wafer Singulation Equipment

Standard wafer mounter and special applications such as non-contact setup (NCS), TAIKO wafer, ultra thin wafer or stealth diced wafer for a variety of wafer materials. To evaluate the right product, we offer sample testing including dicing.  

Fully engineered, designed and manufactured by POWATEC in Switzerland

 

Wafer Mounter

UV Curing System | UV Irradiation System

BG Tape Wafer Laminator | Dry Film Wafer Laminator

Wafer Expander | Die-Matrix Expander

Dicing Cassette | Magazine | Wafer Frame Magazine

Boats

Dicing Service

POWATEC is specialized in the sigulation with high precision diamond dicing blade technology. The wafer diameters range from 50mm to 300mm. Capabilities include bare silicon, SOI wafers, patterned or non-patterned, glass, FP4 and many more non-silicon materials up to a thickness of 2.5mm. We offer wafer mounting, UV curing, die expansion, packaging and customized quality control.

Quantities start from lot size one to conduct empiric R&D trials to larger volumes in order to quickly cover peak demands. Our specialty is our expertise in various applications and a high flexibility. 

 

SMT Pick & Place Devices

Manual or semi-automatic SMD Pick and Place Machine to handle BGA, QFN and part sizes from 0201. Functions include dispensing, high resolution camera with touchscreen, x-y brake, micro placer for BGA, SW to import PCB projects and many feeder options. The immediate readiness, high precision and modular setup ensures highest quality at lot size one. POWATEC is design owner and OEM of the former device generation from ESSEMTEC.   

 

 

EXPERT Manual Pick & Place

EXPERT II-M Semi-Automatic Pick & Place

EXPERT II-M-MPL Semi-Automatic Pick & Place

EXPERT II-FP Semi-Automatic Pick & Place

EXPERT II-FP-MPL Semi-Automatic Pick & Place

MPL Standalone BGA Pick & Place

 

Our Value Proposition

Our value proposition starts when wafers or substrates enter the singulation process. We strive for sustainable solutions and support you to find the right combination of process parameters around wafer dicing. Our innovative design focuses on the needs of manual and semi-automatic operations, offering immediate readiness, requiring a small footprint, and allowing customizations at a reasonable cost. Such customizations include the integration of POWATEC equipment modules into fully automatic customer machines together with our engineering department. 

Our global precense is supported by local sales represenatives, a direct access to large dicing machine player and tape manufacturer as well as relevant semiconductor consumable suppliers. This includes frames, cassettes, Grip Rings, Frame Shipper, Wafer Frame Container, Trays, Wafer Shipper, Blue Tape. 

We are ISO 9001 Certified

Networks & Partnerships: Vistec - We understand E-Beam.

Contact us