Wafer Singulation Equipment
All our machines are engineered and produced in Switzerland by POWATEC with minimal footprint for clean room applications
Each device is customizable and we offer free sample testing or video conferences to identify the best fit for our customer's needs
Manual Wafer Mounter
Powatec wafer mounters are used to prepare wafers for dicing by ensuring the tape is applied air-void free to the wafer and corresponding dicing frame. We offer manual and semi-automatic devices for standard & TAIKO wafers, non-contact setups (NCS), and bumped or structured wafers.
Semi-Automatic Vacuum Wafer Mounter
Powatec wafer mounters are used to prepare wafers for dicing by ensuring the tape is applied air-void free to the wafer and corresponding dicing frame. We offer manual and semi-automatic devices for standard & TAIKO wafers, non-contact setups (NCS), and bumped or structured wafers.
UV Curing System | UV Irradiation System
Powatec UV-LED systems are used to cure UV-sensitive tapes/foils so as to reduce their adhesion levels enough to remove the tape, or pick the dies after wafer singulation.
Back Grinding Tape Laminator
Powatec wafer laminators are used to apply air-void free protective or back grinding tapes onto wafers.
Wafer Expander | Die-Matrix Expander
Powatec expansion tools are used to uniformly stretch the tape on which a singulated wafer is mounted, thereby increasing the space between dies and facilitating further handling.
Auer Boats
Powatec GmbH is a distributor for AUER products in the semiconductor industry including their renowned process carrier (a.k.a. "Auer Boat").
6" and 8" Dicing Cassette | Magazine | Wafer Frame Magazine
Powatec offers a wide range of cassettes/magazines used to ensure the proper storage and handling of mounted wafers according to the size of the frame.
300mm Dicing Cassette | Magazine | Wafer Frame Magazine
Powatec offers a wide range of cassettes/magazines used to ensure the proper storage and handling of mounted wafers according to the size of the frame.