Wafer Mounter

Manual and semi-automatic wafer mounters used to prepare wafers for dicing

Manual Wafer Mounter

Flexible, smart and efficient, for a variety of different wafers, frames and tapes. Over 20 years of design expertise.

P-200 for up to Ø8"
P-300 for up to Ø300mm

Manual Non-Contact Wafer Mounter

Sensitive wafer surfaces require touchless processing. By securing the 5mm border of the wafer via vacuum, the remaining fragile wafer surface can be mounted with our non-contact process.

P-200 Non-Contact for up to Ø8"
P-300 Non-Contact for up to Ø300mm

Semi-Automatic Vacuum Wafer Mounter

Fully automatic core process with a high degree of process quality. Suitable for the highest requirements in process stability, reproducibility, and homogenous adhesion for a variety of flat wafers and substrates. The cycle time typically takes less than 90 seconds.

V-200 for up to Ø8"
V-300 for up to Ø300mm

Semi-Automatic Heated Vacuum Wafer Mounter

Designed to provide top quality and highly reproducible results when mounting thermal film on structured substrates or bumped wafers.

V-200 Heated for up to Ø8"
V-300 Heated for up to Ø300mm

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