UV Flash Curing System UF-300
For the highest requirements in quality control, precision, and efficiency in clean room applications.
- Suitable for 300mm (12") wafers or substrates up to 400mm2
- Includes 10" display and software to set and adjust all necessary parameters
- Dose, intensity, and exposure duration are all selectable in single digits; homogeneity of dose +/- 5%
- 660 high performance UV LEDs
- Nitrogen purge included; journal cycle, API functionality, and automatic calibration all optional
Dose: 75 - 1200 mJ/cm2, adjustable in single digits
Curing Area: 400mm x 400mm
Wafer size: up to Ø300mm (with frame) / up to Ø400mm (without frame)
Frame: up to Ø400mm (standard DTF 2-12)
Substrate thickness: any minimal thickness up to several centimeters
Throughput: up to 300 units per hour (UPH)
Width: 440mm
Depth: 426mm
Height: 200mm
Weight: 23.1kg
Number of LEDs: 660
Peak Wavelength: 365nm +/- 3nm
Radiant flux per LED: 1050mW
Homogeneity of dose: +/- 5% over the entire LED array
Radiation intensity on the surface: 285mW/cm2 @ 1050mW radiant flux per LED
Main Power: 110-240 VAC, 50/60 Hz
Maximum power consumption : 1600W
Standby power consumption: 20W
Nitrogen pressure: 3 bar
Certification: CE Certified, IEC 204-1 safety standards
The UV-LED curing system UF-300 is a highly specialized and automated device for highest demands on precision, repeatability and production quality of UV tape curing. The device can expose commercially available UV tapes from leading manufacturers on up to 300mm wafers with a throughput of 360 wafers per hour. Usual exposure durations are achieved within 0.5-2.5s. To ensure a homogeneous energy distribution of +-5% over the entire surface, the individual LED modules are controlled by electronic drivers. The exposure dose recommended by the film manufacturer can be entered in mJ/cm2 via the touch display. With the optional SW functionality and UV integrator it is possible to retrieve log files of the UV curing, store favorite recipes and correct any LED deterioration over the life time of the LED array.
We customize the device to be equip with LED’s of different wave length such as 405nm or 385nm or to control it via an API. It is also possible to exceed the maximal dose by water cooling or to customize the UF-300 as an integrated module into larger semiconductor fabrication machines.
The device does not need any specific installation except the connection to the nitrogen valve. The low operating costs, small footprint and high quality of the final results make the UF-300 an internationally successful product in the cleanroom applications of well-known large corporations.
Unlike conventional mercury vapor lamp systems, the unit is ready for use immediately after being switched on. Notably, the LED exposure with an average wavelength of 365nm produces neither harmful ozone nor dangerous mercury gas.
Process Overview
The mounted wafer and frame are placed manually onto the protective glass above the LED array with the tape facing down. Once the protection cover is closed, which is monitored by redundancy of switches, the process is started by pressing the start button on the 10" display. Previously it is possible to adjust a variety of parameters such as dose (mJ/mm2), intensity (mW/mm2) or duration (s). Guidance is provided on the 10" display. Once the process is finished, the cover can be opened and the substrate retrieved.
Functionality of the Software Package Option
- Access to journal with the following information: date, time, type of recipe (favorite), dose, intensity, duration, N2 applied (Y/N), and number or repetitions
- Create favorites with reoccurring recipes
- Upload and download information from journal or favorites
- Guided, automatic calibration and correction of LED deterioration with an additional UV integrator. The UV integrator comes together with the software option
Options
Full SW Option & UV Integrator
The full software package provides access to all optional functionalities including the automatic calibration of LED deterioration, via the use of the UV Integrator.
Bar Code Reader
This option allows the user to log the details of the UV curing settings associated with the scanned wafer.
The technology of the UF-300 can be customized to fit into large scale equipment such as dicing saws or front end machines (e.g. hybrid bonding manufacturing equipment). POWATEC offers the technology to be integrated physically but as well via API to control the light field and manage a variety of parameters in real time. Such custumizations include specific light field size adaptions, water cooling of the LED array to extend cycling duration or interfaces for the end-effector placement of the wafer robot system.