Semi-Automatic Wafer Expander SFE-200

Semi-Automatic Wafer Expander SFE-200

The unique design not only expands the singulated wafer without grip/expansion rings, but also transfers it to a new frame while keeping the tension on the tape, thus facilitating subsequent handling.

Precisely expands the space between dies by up to 10mm
Possible to re-mount expanded wafers from 8" to 8" Disco steel frames (DTF 2-8-1)
Requires a seperate device to mount the ring of tape onto the secondary frame

Wafer size: up to 8"

Frame size: Ø8" DTF 2-8-1 K&S

Expansion Range: 5mm - 10mm

Foil thickness: 150 µm (maximum)

Width: 480 mm

Depth: 735 mm

Height: 455 mm

Weight: 50 kg

Power supply: 100 - 240 VAC

Air pressure: 5.5 - 6 bar

Certification: CE Certified, IEC 204-1 safety standards

The SFE-200 is used to expand the tape on which a diced wafer is mounted to widen the saw lines between dies. The device is uniquely designed so that the expanded wafer is transferred from its orginial frame onto a second frame after expansion. The result is an expanded wafer (die-matrix) without grip rings, mounted onto a frame. All process steps such as tape winding/unwinding, tape cutting, expanding, and re-mounting onto a new frame are performed automatically.

Limitations

It is important to note that the expansion is limited. Only wafers can be expanded where the aspect ratio is approx. 1 to 1. For example, x=1 and y =1.2. The Expansion range reaches 5mm to 10mm. The correct selection of film in term of its capability to be stretched is important.

Before the wafer can be expanded, it needs a separate frame mounter which is capable to mount a foil on a frame (for example, Manual Wafer Mounter P-200 or Frame-Mounter TM-852).