info@powatec.com
+41 41 743 13 20
Dicing Service
Our dicing lab is equipped with automatic DISCO and Accretech dicing saws including all necessary tools for pre- and post-process wafer dicing.
We have experience with various materials including Silicon, SOI, Gallium Arsenide (GaAs), Gallium Nitride (GaN), Silicon Carbide (SiC) Aluminum Nitride (AlN), Fused Silica, Quartz, Glass, Sapphire, Germanium, FR4 wafers, and more.
Our commitment to process quality is paramount - we are ISO 9001 Certified
Capabilities
- Wafer size up to 300mm
- Material thicknesses from 50µm - 2.5mm
- Die sizes down to 100µm2
- Irregular shapes (e.g. octagonal, triangular, parallelogram, etc.)
- Kerf width down to 20µm
- Bumped and non-bumped wafers
- Chamfered or beveled cuts with customized angles
- Trench cuts, coring cuts, entry cuts or plunge cuts
- Ultrafast laser services up to 8" including dicing, singulating, welding, and drilling.
Service and Offering
- 24 hour service on demand and volume
- Tape mounting on frame (UV Tape or Blue Tape)
- UV curing
- Die expansion
- Deionized water cleaning
- Vacuum packing
- Shipping in single or multiple wafer boxes
- Pilot plant development for glass-sealed microsystems manufacturing
- Engineering and consulting for glass-sealed microsystems development (medical implants, micro-optic devices, PICs)
- Standard clean room handling at ISO7 (Class 10,000); ISO5 (Class 100) available on demand
Quality & Infrastructure
- QMS according ISO 9001
- Grey and clean room environment (up to ISO 5/Class 100)
- High purity deionized water including high performing surfactant
- ESD protection (floor, testing station, shoes, and wrist straps)
- Fully automated dicing saws
- Semi-Automatic UV curing systems and wafer mounters
- Automatic cleaning stations
- Vacuum sealing packaging
- Production protocols
Our Commitment
We offer our dicing services to customers requiring a single wafer to hundreds of wafers to be processed. We have more than 25 years of experience operating our dicing facility and we leverage that experience to support our customers with their standard or highly specialized requests. We work with our customers to develop their required dicing process(es) by consulting on production parameters, tapes, handling materials, and process sequences.
