info@powatec.com
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Wafer Mounter
Manual and semi-automatic wafer mounters used to prepare wafers for dicing
Manual Wafer Mounter
Flexible, smart and efficient, for a variety of different wafers, frames and tapes. Over 20 years of design expertise.
Manual Non-Contact Wafer Mounter
Sensitive wafer surfaces require touchless processing. By securing the 5mm border of the wafer via vacuum, the remaining fragile wafer surface can be mounted with our non-contact process.
Semi-Automatic Vacuum Wafer Mounter
Fully automatic core process with a high degree of process quality. Suitable for the highest requirements in process stability, reproducibility, and homogenous adhesion for a variety of flat wafers and substrates. The cycle time typically takes less than 90 seconds.
Semi-Automatic Heated Vacuum Wafer Mounter
Designed to provide top quality and highly reproducible results when mounting structured substrates or bumped wafers with heated surfaces, in a vacuum chamber.
Semi-Automatic Silicon Carbide Wafer Mounter V-150 SiC
The highest level of process control and repeatability while still offering flexibility, all in a table-top device. Automatic opening and closing of the lid, independent temperature settings for bottom versus top chucks, and the ability to change all parameters in Process Development mode or lock all parameters to run in Production mode.
Semi-Automatic Wafer Mounter
Powatec wafer mounters are used to prepare wafers for dicing by ensuring the tape is applied air-void free to the wafer and corresponding dicing frame. We offer manual and semi-automatic devices for standard & TAIKO wafers, non-contact setups (NCS), and bumped or structured wafers.
