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UV Curing / UV Release / UV Irradiation
Our high-powered UV LED technology is used to reduce tape adhesion when picking dies after wafer singulation, or for UV treatment of various kinds of materials.
Fully engineered, designed and manufactured by POWATEC in Switzerland.
Standard UV Curing Systems
U-200 cures 8" wafers and frames (DTF 2-8-1) up to an outer diameter of up to Φ296mm
U-300 cures 12" wafers and frames (DTF 2-12) up to an outer diameter of up to Φ400mm
U-450 cures wafers and frames on an exposure area of 580mm2
UV Flash Curing System
The UF-300 has an exposure area of 400mm2 and is used to cure UV release tape mounted on wafers and dicing frames.
This system is operated via API and can be integrated into a variety of host machines (e.g. hybrid bonding machines, dicing saws, etc.).
