Wafer size: 6" to 300 mm

Wafer type: flat surface

Wafer thickness: 80µm to 3mm

Maximum height of structures/bumps: 170µm

Maximum temperature: 100°C / 212°F

Frame size: Ø300mm DTF 2-12 / Ø8" DTF 2-8-1 (on request)

Width: 470 mm

Depth: 750 mm

Height: 1100 mm

Weight: 43 kg

Temperature range: up to 90°C

Temperature control unit (each): Width: 260mm / Depth: 240mm / Height: 180m / Weight: 9kg

Vacuum required: 2 mbar absolute, Festo PUN-8, Ø8 mm

Pressure required: 4-6 bar, Festo PUN-6, Ø6 mm

Power input: 110-240 VAC

Cooling Water requirement: 20-25 °C, de-ionized water

Clean room application: in use up to ISO 4 - 5 

A-weighted emission sound pressure level: does not exceed 70 db(A), excluding vacuum pump

Peak c-weighted instantaneous sound pressure value at workstations: does not exceed 63 Pa, excluding vacuum pump

Certification: CE Certified, IEC 204-1 safety standards

This device is specifically designed to maximize the degree of automation of the mounting process for structured or bumped wafers. Only the pure handling is kept manually to safe cost, footprint and ensure equipment longevity. In fact, the V-300H does not consist of any electrotechnical actuators which guarantees maximum MTBF and no periodic consumables. Customers who choose this equipment pay attention to:

• a proper contact between the tape and around the structures (bumps) on the wafer
• a high degree of process repeatability and independence of human errors 
• the wafer must be uniformly brought into contact with the tape over its entire surface (no transversal movement)
• a device which does not require any adjustment for different wafer thicknesses

Operation

It is important to understand, that the V-300H requires a frame to be mounted with a tape beforehand. That can be done on a Manual Wafer Mounter P-300 or any other frame mounter on the market. Once that is prepared, the wafer and the mounted frame are placed into the V-300H chamber by still keeping a gap between the wafer surface and the tape. Once the cover is closed, the V-300H will evacuate the chamber to approximately 3 mbar and then automatically bring both, the wafer and the tape into contact with each other. By applying vaccum, a bubble free and perfect mount is ensured. Finally, the chamber can be opened and the mounted wafer on tape with frame can be retrieved. Parameters such as pressing force, vacuum level, timing can all be adjusted via HMI on the device itself or the heat controller.   

Flexibility

A special strength of the V-300H is its modular design. The exchange of chucks for different wafers can be done within less than 1 minute. There is no height adjustment necessary of the chuck. It is important to note that different wafer sizes do not always require a different chuck to be used. Besides the standard heated chuck, ask about our wide range of customized chucks of any special shapes. The V-300H operates independently of any specific type of tape, so long as it is intended for heated processes. 

Limitations

If your processed wafer surface is absolutely not allowed to be touched during any step of the mounting, we suggest to check out for our Manual Wafer Mounter P-300 Non Contact.