Wafer size: 6" to 8" mm

Wafer type: flat surface

Wafer thickness: 80µm to 3mm

Maximum height of structures/bumps: 170µm

Maximum temperature: 100°C / 212°F

Frame size: Ø8" DTF 2-8-1 / Ø6" DTF 2-6-1 (on request)

Frame material: Steel

Width: 470 mm

Depth: 750 mm

Height: 1100 mm

Weight: 40 kg

Vacuum requirement: 2 mbar absolute, Festo PUN-8, Ø8 mm

Pressure requirement: 4-6 bar, Festo PUN-6, Ø6 mm

Power input: 110-240 VAC

Clean room application: in use up to ISO 4 - 5

A-weighted emission sound pressure level: does not exceed 70 db(A), excluding vacuum pump

Peak c-weighted instantaneous sound pressure value at workstations: does not exceed 63 Pa, excluding vacuum pump

Certification: CE Certified, IEC 204-1 safety standards

This device is specifically designed to maximize the degree of automation in the mounting process for structured or bumped wafers. Only the pure handling steps are manual to ensure equipment longevity, and save on space and cost for the customer. In fact, the V-200H does not consist of any electromechanical actuators, which, guarantees a maximum MTBF (mean time between failures) and no periodic consumables.

Customers who choose this device typically demand:

• a proper contact between the tape and around the structures (bumps) on the wafer
• a high degree of process repeatability and independence of human errors 
• the wafer must be uniformly brought into contact with the tape over its entire surface (no transversal movement)
• a device which does not require any adjustment for different wafer thicknesses

Operation

It is important to understand that the V-200H requires a frame to be mounted with a tape beforehand. That can be done on a Manual Wafer Mounter P-200, Frame-Mounter TM-852, or any other mounter on the market. Once that is prepared, the wafer and the mounted frame are placed onto separate sides of the V-200H chamber. Once the cover is closed, the V-200H will evacuate the chamber to approximately 3 mbar and then automatically bring both the structured wafer and the tape into uniform contact with each other. By applying a vacuum, a bubble-free and homogeneous mount is ensured. Finally, the chamber can be opened and the wafer mounted onto the tape and frame can be retrieved. Parameters such as temperature, pressing force, vacuum level, and timing can all be adjusted via the device HMI or the temperature control unit.  

Flexibility

A special strength of the V-200H is its modular design. The exchange of chucks for different wafers can be done within less than 1 minute. There is no height adjustment necessary of the chuck. It is important to note that different wafer sizes do not always require a different chuck to be used. Besides the standard heated chuck, ask about our wide range of customized chucks of any special shapes. The V-200H operates independently of any specific type of tape, so long as it is intended for heated processes.

Limitations

If your processed wafer surface is absolutely not allowed to be touched during any step of the mounting, we suggest to check out our Manual Wafer Mounter P-200 Non-Contact.