Wafer size: 4" to 6" / 6" to 8" / 8" to 300mm

POWATEC Grip Ring / Inner/Outer Diameter*: For 6" Wafer: 170mm/186mm / For 8" Wafer: 227.7mm/248mm / For 300mm Wafer: 330mm/347mm

Frame size: DTF 2-6-1 K&S / DTF 2-8-1 K&S / DTF 2-12 K&S

Throughput: Up to 200 UPH (units per hour)

Height with piston at top position: 1060 mm

Height with piston at bottom position: 890 mm

Depth: 400 mm

Width: 310 mm / 330 mm / 400 mm

Stroke: 420 mm 

Weight: 50.1 kg / 51.1 kg / 52.6 kg

Certification: CE Certified, IEC 204-1 safety standards

*Inner Diameter = Inner diameter of inner grip ring

Outer Diameter = Outer diameter of outer grip ring

The POWATEC ETM-300 wafer expansion tool is an easy-to-use and flexible product that offers a high degree of repeatability and reproducibility in the wafer expansion process. The ETM-300 features a high-precision press that ensures the grip rings are perfectly clamped together, while providing uniform expansion on mounted wafers up to 300mm.

Product Design

The Swiss-made arbor press is in daily use in over 30 countries worldwide and trusted to provide precise and high quality results. The robust design includes high clearance and a long stroke allowing for a more ergonomic operation. The gear shafts are made of case-hardened steel and the press ram is made of teniferized (QPQ) steel to exert the necessary expanding pressures. The guide holes for the punch are ensured with a tolerance of 40H7 and the punch with 40H6. Thus, the guidance of the punch is ensured with a minimum clearance down to lowest position. This is the only arbor press with a ram brake that prevents the ram from lowering independently, thus minimizing the risk of hazards.

Process Overview

As the core process of expansion is determined by the shape of the press stamp, these products provide highly consistent and reproducible results as they are independent of the operator. This easy-to-use design means an operator can achieve a production throughput of up to 200 expansions per hour, which is higher than many semi or even fully automatic solutions. Simply insert the grip rings into the presses, place the diced wafer onto the base plate, and lower the press using the operating wheel until the grip rings are pressed together. 

Flexibility

Each machine can be made to accommodate a myriad of combinations of smaller or larger grip rings, frames, and wafers in just a few quick steps. Multiple expansions to expand wafers with many small dyes are also easily handled. The process is simply repeated the desired number of times with the determining factor being the tear strength of the tape.

The diameter of the operating wheel is optimized to allow for increased leverage so it is easier to apply the necessary force, lending to its ergonomic design.