Manual Non-Contact Wafer Mounter P-300-NC

Manual Wafer Mounter P-300 Non Contact

To prepare the wafer for the dicing without touching its sensitive surface

Limit the contact between the chuck and wafer surface to only a 6mm border
Design ensures limited force is applied onto the wafer while mounting
Able to process very sensitive wafers or wafers with structures

Wafer size: up to 300mm

Wafer type: Non-Contact of the processed side

Wafer thickness: 50µm to 4.5mm

Frame size: Ø300mm DTF 2-12 & DTF 2-12-1 / Ø8"DTF 2-8-1 with insert ring / K&S

Width: 590 mm

Depth: 880 mm, (1000 mm with PTW)

Height: 250 mm

Weight: 25 kg, (33 kg with PTW)

Film width: 200 to 400 mm

Vacuum requirement: -70 kPa

Vacuum connection: outer diameter ø 6 mm

Power input for PTW option: 115 - 230 VAC

Power input for Non-Contact Unit: 100-240 VAC

Pressure input for Non-Contact Unit: 1.5 - 2 bar, OD Ø4 mm

Vacuum connection for Non-Contact Unit: min -0.5 bar, OD Ø4 mm

Clean room application: in use up to ISO 4 - 5

A-weighted emission sound pressure level: does not exceed 70 db(A)

Peak c-weighted instantaneous sound pressure value at workstations: does not exceed 63 Pa

Certification: CE Certified, IEC 204-1 safety standards

Despite all of the automation and the importance of accurate handling, human haptic capabilities are, in many cases, superior to sophisticated automated systems. This device is specifically designed to maximize ergonomics and the advantages of the operator's capabilities as well as to minimize life cycle costs. This device has a proven record of nearly zero break down time since its inception over 20 years ago. The only periodic consumables are the blades and the carbon tissue of the chuck.

Customers who handle wafers which are not allowed to be touched on the processed wafer surface require a non-contact chuck. The P-300-NC chuck keeps the wafer stable during the mounting through a vacuum applied within 7mm of the outer border of the wafer. Underneath the remaining area of the wafer, the chuck is air pressurized to compensate the bending of the wafer by its own weight during the mounting process. The exerted force on the non-contact area of the wafer is entirely controlled by the air pressure within the cavity between the wafer and the chuck. That keeps the fragile structures on the wafer away from any contact.

Flexibility

A special strength of the P-300-NC is its modular design. By simply adding an insert ring into the chuck table it is also possible to mount wafers on a DTF 2-8-1 frame as well. Switching between DISCO or K&S frame types is possible via the exchangeable positioning pins. Exchanging chucks for different wafers can be done in less than 1 minute, including the height adjustment of the chuck. The P-300-NC can also be combined with all standard and customized chucks of the standard P-300 Wafer Mounter. Also, the P-300-NC can handle various type of standard or UV release films between 200 and 400mm wide, and our tape reel holder makes it easy to switch between your different tapes and always have it mounted correctly.

Limitations

If you process wafers with bumped surfaces (such as lenses), check out our Semi-Automatic Vacuum Wafer Mounter V-300 or our Semi-Automatic Heated Vacuum Wafer Mounter V-300H.

Options

PTW (Protection Tape Winder)

When using UV release film, the use of the PTW is recommended. It automatically winds up the UV protection film via a high quality integrated drive. The PTW is mounted on the back of the wafer mounter.

ESD Bar

Unwinding of the film can lead to electrostatic charges. To limit such electrostatic charges it is recommended the use of an ionizing air bar. The bar is installed in the proximity of the tape peel-off point where the greatest electrostatic charges occur. The corresponding control unit is included in the scope of delivery.

Insert ring for 8" Frame

To mount up to 8" wafers with a DTF 2-8-1 or K&S Frame. The exchange time is less than 1min.

Measurement tool for ESD bar

It is recommended to perform a periodic functional check of the ionizing bar.

Standard Chuck Sizes

Our chucks are available in the following sizes: 2", 4", 6", 8", or 300mm.

Consumables

Cutting blade set

Circular cutting blades and lateral cutting blades in a separate box. The exchange is simple and properly described in the operations manual.

The surface of the outer boarder of the chuck is made of blank aluminum. Some customers perfer to harden the surface by anodizing. An additional teflon coating fills the anodized pores to ensure proper vaccum.

Downloads

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FAQs

Can I let my samples being tested by a P-300-NC at POWATEC?
YES. If you are seriously interested in aquiring a P-300-NC, but would like to have it tested with your own samples first, then we can offer a free sample testing at our facility. We also support you in the selection of suitable tapes/films and offer free dicing or UV curing, if needed. Furthermore, as a proof of record, we can offer a live stream or video recording to document your samples being processed with the P-300-NC. Alternatively, we are more than happy to welcome you to visit our facility for an in-person demonstration.

How do I ensure not to apply too much force on the wafer when mounting with the pad roller?
This is a non-contact option where the non-contact area of the wafer is prevented from being touched during the entire process. The force applied on the wafer, even though it is performed manually, will always remain equal to the air pressure which is regulated by the controller.

Do I need a separate chuck for each wafer size?
YES. Also the tolerance of the wafer should not exceed +/- 0.1% (SEMI Standard tolerance).

What is the minimum wafer thickness the device can support?
The minimum wafer thickness on the standard device is 50µm, however, the wafer should be able maintain integrity and hold its own weight on the chuck until the air pressure is activated. For thinner wafers, contact your Powatec representative for more information.

What is the maximum wafer thickness the device can support?
The maximum wafer thickness on the standard device is 4.5mm, however, the device can support thicker wafers with some customization. Contact your Powatec representative for more information.

Does POWATEC offer heated chuck options?
This is very unusual for a non-contact chuck, but in principle, yes.

Does POWATEC offer chucks for square wafer / glass substrate / multiple substrates at once / very small wafers or fraction of wafers?
YES, however each Wafer size or different shape requires a dedicated chuck.

Is it possible to mount Bumped wafers with the P-300-NC?
YES, however the border of the Wafer (6mm) must be free from structures.

Can the P-300-NC be upgraded to include the PTW or ESD options after it is delivered?
YES, however please contact POWATEC to ensure the compatibility.

Can the P-300-NC be converted into a standard P-300 or L-300?
YES, simply replacing the Chuck and the circular cutting knife module is sufficient. Please contact POWATEC for further details.

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