Manual & Semi-Automatic Pick-and-Place Devices

SMT Pick-and-Place

Manual and semi-automatic solutions for precise component placement — flexible, operator-friendly, and ready for a wide range of board sizes and component types.

Solder Paste Application

Consistent and repeatable paste deposition, from manual dispensing to stencil printing — the foundation of a reliable solder joint.

Controlled temperature profiles for clean, stable solder connections across the entire board — consistent results from prototype to series production.

Targeted repair and component replacement without board damage — essential for prototyping, production repairs and field returns.