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Precise, Controlled, and Repeatable
Controlled temperature profiles for clean, stable solder connections across the entire board — consistent results from prototype to series production.
Forced Air Convection
FT05 Reflow Oven
The FT05.ADV is a new-generation professional reflow oven, designed to work with the latest high-temperature alloys. Heat is distributed by forced convection for maximum precision.
FT03 Reflow Oven
FT03 was designed for reflow solder paste and polymerization of glues for prototypes or small series. Thanks to its new heating system and upgraded electronics, it is compatible with high-temperature alloys, including lead-free ones.
Vapor Phase
VS-500-V Vapor Phase Reflow Oven
This compact vapour phase soldering machine is designed to handle even the most complex PCBs, with maximum dimensions of 500 x 500 x 60 mm.
