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Precise, Controlled, and Repeatable
Controlled temperature profiles for clean, stable solder connections across the entire board — consistent results from prototype to series production.
Forced Air Convection
FT03 was designed for reflow solder paste and polymerization of glues for prototypes or small series. Thanks to its new heating system and upgraded electronics, it is compatible with high-temperature alloys, including lead-free ones.
The FT05.ADV is a new-generation professional reflow oven, designed to work with the latest high-temperature alloys. Heat is distributed by forced convection for maximum precision.
Vapor Phase
This compact vapour phase soldering machine is designed to handle even the most complex PCBs, with maximum dimensions of 500 x 500 x 60 mm.
