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FT03 Reflow Oven
Reflow Oven Soldering with Forced Air Convection
The FT03 oven has been developed for the reflow of solder paste and the polymerization of glues in prototyping applications. Thanks to its new heating system and upgraded electronics, it is compatible with high-temperature alloys, including lead-free ones.
Coming soon …
Coming soon …
Coming soon …
Coming soon …
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